
Wafer Edge Grinding:W-GM-5200
• Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
• The non-contact measuring method achieves the stable alignment.
• Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
• The modular concept to make the optimum process line possible.
• Low damage grinding method is available.
Feature 1 :
Machine specification ready for 300 mm and 200 mm wafer.
Feature 2 :
Visual system (optional) for measuring the chamfer width of periphery and notch.