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Applications :6인치 Wafer,PCB,Die 등X/Y Travel Limits :150mm(linear drive,50nm resolution)Z Travel Limits :100mm(servo drive,50nm resolution)Available Sensors :Chromatic confocal,IR interferometer,CFM,WLI,RFMDimensions (W x L x H) :701mm x 487mm x 823mmWeight :86kg
Sale Company
| CEO Name | LEE, HAE GYUN |
|---|---|
| Phone | 0504-3105-7944 |
| Homepage | 3hcorp.co.kr/ |
| sales@3htech.co.kr | |
| Address | 13572, Seohyeon-ro 257beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, Republic of Korea |
